ผู้จัดการฝ่ายวิจัยและพัฒนา
สถานที่ทำงาน
กรุงเทพมหานคร - บางนา
สายงาน
ฝ่ายบริหารจัดการระบบข้อมูลและไอที
เงินเดือน
ไม่ระบุ
ความสามารถด้านภาษา
ชาวต่างชาติสามารถสมัครได้
ไม่ได้
ลักษณะงาน
หน้าที่และความรับผิดชอบ
Manage Packaging R&D team to achieve task for
1. Package assessment
• Package Technology development
• Package Characterization and performance database center
• Establish product packaging assembly and process control requirements
• Risk assessment on new product and process change
• Package performance quality concern
2. Material Development
• Material technology Development
• Material prediction look-ahead assessment
• Material screening and BOM selection
• Assess fit for product/ process and reliability=define DFM, DFA, DFR and design rule
• Value engineering (improve productivity, lower cost, etc)
3. 2nd level/ system packaging assessment
• Next process (Final Test, PCBA) define appropriate application and handling
• 2nd Level/ System packaging/ MCM Module
• Assess reliability and link with Group R&D for simulation model & prediction
Thermal characteristic test, Electrical characteristic test
คุณสมบัติ
• Bachelor degree or Master degree in Science or Engineering related field
• At least 10 years in IC manufacturing factory
• R&D or IC packaging background is prefer
• Team management
• Thermal mechanical property and analysis knowledge
• Analytical thinking
• Communicative both English and Thai in verbally and writing
• Systematic Thinking and Flexible
• Good responsibility and ownership
Manage Packaging R&D team to achieve task for
1. Package assessment
• Package Technology development
• Package Characterization and performance database center
• Establish product packaging assembly and process control requirements
• Risk assessment on new product and process change
• Package performance quality concern
2. Material Development
• Material technology Development
• Material prediction look-ahead assessment
• Material screening and BOM selection
• Assess fit for product/ process and reliability=define DFM, DFA, DFR and design rule
• Value engineering (improve productivity, lower cost, etc)
3. 2nd level/ system packaging assessment
• Next process (Final Test, PCBA) define appropriate application and handling
• 2nd Level/ System packaging/ MCM Module
• Assess reliability and link with Group R&D for simulation model & prediction
Thermal characteristic test, Electrical characteristic test
คุณสมบัติ
• Bachelor degree or Master degree in Science or Engineering related field
• At least 10 years in IC manufacturing factory
• R&D or IC packaging background is prefer
• Team management
• Thermal mechanical property and analysis knowledge
• Analytical thinking
• Communicative both English and Thai in verbally and writing
• Systematic Thinking and Flexible
• Good responsibility and ownership